Letter

William H. Seward to William L. Dayton, June 8, 1864

Mr. Seward to Mr. Dayton

No. 573.]

Sir: Referring to my instructions of the 23d ultimo, No. 557, and to its accompaniments relative to the rude treatment of Mr. Chase, the United States consul at Tampico, by the French military commandant there, I now transmit a copy of a further despatch from Mr. Chase of the 10th ultimo, No. 21, which gives a more detailed account of the matter. I need only say that the aggression on the consul, for which you can ask reparation, is the menace contained in the second note of the French commandant to Mr. Chase.

I am, sir, your obedient servant,

WILLIAM H. SEWARD.

William L. Dayton Esq., &c., &c., &c.

Sources
FRUS u2014 Papers Relating to Foreign Affairs, Accompanying the Annual Message of the President to the Second Session Thirty-eighth View original source ↗
U.S. Department of State, Office of the Historian. Papers Relating to Foreign Affairs, Accompanying the Annual Message of the President to the Second Session Thirty-eighth.