Letter
William H. Seward to William L. Dayton, May 23, 1864
Mr. Seward to Mr. Dayton
No. 557.]
Department of State, Washington, May 23, 1864.
Sir: I enclose a copy of a despatch of the 27th ultimo, and of its accompaniments, addressed to this department by Mr. Chase, consul general of the United States at Tampico, from which it appears that that officer has been treated very rudely by the French military commandant there, and even threatened with imprisonment. You will make a proper representation upon the subject to the minister for foreign affairs of France, and will state to him that due reparation will be expected by this government. As the correspondence speaks for itself, no inquiry as to the facts of the case would seem to be necessary.
I am, sir, your obedient servant,
WILLIAM H. SEWARD,
William L. Dayton Esq., &c., &c., &c.
Topics
Sources
FRUS u2014 Papers Relating to Foreign Affairs, Accompanying the Annual Message of the President to the Second Session Thirty-eighth
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U.S. Department of State, Office of the Historian. Papers Relating to Foreign Affairs, Accompanying the Annual Message of the President to the Second Session Thirty-eighth.